Use over:
APA underlayment grade plywood and OSB
Association grade particleboard
Cement backer board
Cementitious and anhydrite screeds
Concrete and radiant heated subfloors that do not exceed 85°F (30°C)
Gypsum and lightweight concrete
Well-bonded residue from cutback adhesives
Well-bonded residue from multipurpose, latex, and pressure sensitive adhesives
Features & Benefits
• Protects floating and loose-lay flooring
• 93-95% moisture protection
• Inhibits mold/mildew growth
• Encapsulates cutback residue
• Fast-drying formula
• Detackifies existing adhesive residue
• Primes porous substrates
• Protects flooring from alkali attack
• Attractive price point
• 1-step installation (no stirring/mixing)
• Fast roller application
• Solvent and isocyanate-free
• Zero VOC, extremely low odor
